1. This reballing station adopt high alloy material as structure, light and
2. This product is a BGA diagonalplanting fixture with all aluminium alloy plating
3. Not easy to oxidize, wear‑resistant, and suitable for 9mm to 43mm BGA chipplanting
4. Adjust the chip size knob and set the diversion to facilitate the pour out of excess tin beads
5. Used for laptop CPU, mobile phone products plant tin rework with BGA manual welding

Specification:
Item Type: BGA Reballing Station
Product : HT-90 90x90
Applicable Steel : Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone products.

Package List:
1 x BGA Reballing Station
1 x Hex Wrench